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[ITES]SiC Brochure Download

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Contents

Carrier Distribution Analysis in Semiconductors by sMIM

A Full Range of SiC Device Failure Analysis

Comparison of conventional chip burn in and E-V-C method

The position of BPD TED conversion points and photoluminescence

Quantification of correlation between forward bias expansion and UV expansion

The development of the E-V-C inspection system

SiC wafer crystal defect inspection & analysis service

The Interfacial etching pits method by polishing and molten KOH

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